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Polyamide-Resin-Benzene-Soluble

Polyamide Hot-melt Adhesive

Product  description :

Polyamide Hot-melt Adhesive

Composition: ·100%

Features:

  1. Good adhesiveness, adheres to most surfaces with high bonding strength.
  2. Good high and low temperature resistance, and have excellent thermal stability
  3. Good oil –resistance and good electric insulation
  4. Have lower viscosity at melting condition
  5. 100% solid, no pollution and toxicity.
  6. Specially formulated for low pressure molding

Application:

It is fit to be used for the adhesion of materials like electric appliances, heat-shrinkable material, packing material, fabrics, leather, lumber, plastic, metal, ceramics, etc.

Packaging Details: 25KG//Bag